Trusted Foundry Access III – Manufacturing   2

Background
The Defense Microelectronics Activity (DMEA) is focused on addressing the warfighter’s needs by researching microelectronics issues, extending the life of weapon systems, improving reliability, and ensuring a reliable supply chain of Trusted manufacturers of key microelectronics technologies. The purpose of the TFA3 Program is to ensure uninterrupted access to secure semiconductor foundry services over a 10-year period for the DoD and other federal agencies.

Work Details
The contract involves providing manufacturing services in support of DMEA's Trusted Foundry Access Program Office (TAPO) TFA3 Statement of Objectives and Task Orders. The IDIQ contracts have a 10-year total ordering period with firm fixed price task orders. The contract will provide Trusted access to advanced microelectronic Application Specific Integrated Circuits (ASIC) technologies and supporting fabrication processes and services for the DoD and other federal agencies. The required technologies include lithographic generation technologies developed for the commercial market based on bulk Complimentary Metal-Oxide Semiconductor (CMOS) processes, Silicon-Germanium (SiGe,) and Silicon-on-Insulator (SOI) technologies.
The contractor is also required to provide security and export regulation controls, process technologies, photomask sourcing, base intellectual property, technology ancillary process objectives, program management requirements, and distribution list.

Period of Performance
The period of performance for the contract is from 16th August 2023 to 15th August 2033.

Place of Performance
The product will be delivered to Defense Microelectronics Activity (HQ), located at 4234 54th Street, McClellan CA 95652.