Shadow Mask Aligner

Background
The contract is issued for the procurement of a Shadow Mask Aligner, which is essential for improving the alignment of patterned masks to substrates in order to effectively accomplish pattern transfer.
This equipment is critical for agencies involved in advanced manufacturing and semiconductor fabrication.

Work Details
The Shadow Mask Aligner must meet the following specifications:
- Alignment within 1 micron tolerance.
- Objective lens viewport with lateral X-Y range of motion across 76.2 mm, 100 mm, and 150 mm.
- Soft clamping mechanism to prevent wafer breakage.
- Base unit equipped with 3 linear axes, 1 rotation axis, and 2 tilt axes for tilt (wedge) error compensation.

Period of Performance
Delivery is required within 4 months upon receipt of purchase order.

Place of Performance
The specific geographic location for delivery has not been provided.