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Next-Generation Microelectronics Manufacturing (NGMM)   6

ID: HR001122S0050 • Type: Presolicitation

Description

Posted: Oct. 3, 2022, 1:51 p.m. EDT
Amendment 02 - The purpose of this amendment is to extend the Full Proposal Due Date to October 12, 2022.
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
Posted: Aug. 30, 2022, 4:31 p.m. EDT
Posted: Aug. 5, 2022, 6:21 p.m. EDT
Background
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems.
The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.

Work Details
The Statement of Work (SOW) includes defining the 3DHI microsystems to be evaluated in the Phase 0 study, identifying process modules for 3DHI exemplar microsystem manufacture, providing a detailed description of the objective and approach for each defined task/activity, identification of the primary organization responsible for task execution, completion criteria for each task/activity, definition of all deliverables, schedules and measurable milestones for the proposed research, description of results and technology transfer, risk analysis and mitigation plan, comparison with other ongoing research, proposer accomplishments in closely related research areas, national security impact statement, facilities and equipment description, teaming arrangements details, security management architecture and/or approach for the proposed effort.

Overview

Response Deadline
Oct. 12, 2022, 1:00 p.m. EDT (original: Sept. 21, 2022, 1:00 p.m. EDT) Past Due
Posted
Aug. 5, 2022, 6:21 p.m. EDT (updated: Oct. 3, 2022, 1:51 p.m. EDT)
Set Aside
None
Place of Performance
Not Provided
Source
SAM

Current SBA Size Standard
1000 Employees
Pricing
Multiple Types Common
Odds of Award
46%
On 8/5/22 Defense Advanced Research Projects Agency issued Presolicitation HR001122S0050 for Next-Generation Microelectronics Manufacturing (NGMM) due 10/12/22. The opportunity was issued full & open with NAICS 541715 and PSC AC12.
Primary Contact
Name
BAA Coordinator   Profile
Phone
None

Documents

Posted documents for Presolicitation HR001122S0050

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Additional Details

Source Agency Hierarchy
DEPT OF DEFENSE > DEFENSE ADVANCED RESEARCH PROJECTS AGENCY (DARPA) > DEF ADVANCED RESEARCH PROJECTS AGCY
FPDS Organization Code
97AE-HR0011
Source Organization Code
500035490
Last Updated
March 5, 2023
Last Updated By
darpa.fbo.gov@darpa.mil
Archive Date
March 5, 2023