Next-Generation Microelectronics Manufacturing (NGMM) Phase 1 and Phase 2 Proposers Day Special Notice

Background
The Defense Advanced Research Projects Agency (DARPA) is hosting a Proposers Day in support of DARPA-PA-24-03, the forthcoming Program Announcement (PA) for Phase 1 and Phase 2 of the Next-Generation Microelectronics Manufacturing (NGMM) program. The goal of the Proposers Day is to introduce the science and technology community to the NGMM program, collect questions, and encourage teaming arrangements among organizations with relevant expertise, research facilities, and capabilities for executing research and development responsive to the NGMM program goals.

Work Details
The NGMM program seeks to establish a domestic capability for research, development, and production of three-dimensional heterogeneously-integrated (3DHI) microelectronics. The program will advance the state-of-the-art in 3DHI microelectronics through the formation of a domestic open-access prototyping and pilot line center accessible to users in academia, Government, and industry. Phase 1 will focus on establishing baseline fabrication processes, a three-dimensional assembly design kit (3D-ADK), and electronic design automation (EDA) and simulation software tailored to 3DHI.
Phase 2 will build upon the developments in Phase 1 to create hardware prototypes, further automate processes, and develop emulation/digital twin capabilities.
The end goal of the program is to create a self-sustaining 3DHI manufacturing center owned and operated by a non-federal entity, accessible to users in academia, Government, and industry.

Period of Performance
The NGMM program encompasses a five-year effort.

Place of Performance
The Proposers Day will be held at the Booz Allen Hamilton Conference Center, 8283 Greensboro Drive, McLean, VA 22102. It will also be streamed via webcast.