Next-Generation Microelectronics Manufacturing (NGMM) Workshop

Background
The Defense Advanced Research Projects Agency (DARPA) will host a workshop to explore challenges and recommendations to guide the establishment of a domestic research and development (R&D) center for prototyping and pilot-line manufacturing of three-dimensional heterogeneously integrated (3DHI) microsystems. The workshop will be held on September 19, 2023 at the DARPA Conference Center (DCC), 675 North Randolph Street, Arlington, VA 22203 from 8:30 a.m. to 5:00 p.m. ET. The purpose of the meeting is to promote discussion on this topic, address new insights and challenges in this area, and provide an opportunity for different communities to share their capabilities and ideas for future teaming arrangements.

Work Details
The next major wave of microelectronics innovation is expected to come from the ability to integrate heterogeneous materials, devices, and circuits through advanced packaging, producing a tightly-coupled system that extends into the third dimension with performance that exceeds what is available from today’s monolithic approach.

Phases 1 and 2 of the NGMM program seek to create an operational R&D capability for advanced heterogeneously interconnected components for stakeholders in academia, small and medium businesses, defense and commercial companies, and government organizations. Technologies and material systems involved will include, but are not limited to, silicon, compound semiconductors, photonics, and microelectromechanical systems (MEMS), and extend into the power, analog, and radio frequency (RF) domains, in addition to digital logic and memory.

The objective of the NGMM workshop is to discuss the responses to the research areas and manufacturing challenges received from RFI SN-23-84 and provide an opportunity for different communities (e.g., tool manufacturers, electronic design automation companies, assembly and test organizations, fabless companies, defense companies, etc.) to interact.

The goals of the NGMM workshop include addressing facility capabilities for multi-chip, multi-semiconductor materials assembly, packaging, and testing of 3D stacked chips and chiplets; fabricating, packaging, assembling, and testing 3DHI microsystems with an interconnect pitch between components less than 500 nm; increasing automation in 3DHI packaging and assembly processes; multi-physics and multi-scale modeling and simulation tools; creating standardized 3D Assembly Design Kits (3D-ADKs); and establishing a business model that provides equitable access for all stakeholders to this R&D manufacturing capability.

Period of Performance
September 19, 2023

Place of Performance
DARPA Conference Center (DCC), 675 North Randolph Street, Arlington, VA 22203