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Next Generation Microelectronics Manufacturing   6

ID: HR001122S0050 • Type: Award Notice

Description

The objective of the NGMM program is to establish a domestic center for R&D and manufacturing 3DHI (3D heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems.

This effort was competitive. This was awarded as a cost-plus fixed fee contract due to the uncertainties in pricing this effort. In selecting the appropriate contract type, the contracting officer considered the factors in FAR 16.104.

Overview

Award ID
Reported Award
$2,836,760
Agency
None Found
Award Date
June 1, 2023
Posted
June 5, 2023, 5:56 p.m. EDT
Set Aside
None
Place of Performance
Redondo Beach, CA 90278 United States
Source
SAM

Current SBA Size Standard
1000 Employees
Pricing
Cost Plus Fixed Fee
Next Generation Microelectronics Manufacturing (HR001122S0050) was awarded to Northrop Grumman Systems Corporation on 6/5/23 .
Primary Contact
Name
Carrie Bartsch   Profile
Phone
None

Secondary Contact

Name
Laura Pottner   Profile
Phone
None

Documents

Posted documents for Award Notice HR001122S0050

Question & Answer

Opportunity Lifecycle

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Additional Details

Source Agency Hierarchy
DEPT OF DEFENSE > DEPT OF THE AIR FORCE > AFMC > AIR FORCE RESEARCH LABORATORY > FA2385 USAF AFMC AFRL PZL AFRL PZLD
Source Organization Code
500177446
Last Updated
June 19, 2023
Last Updated By
laura.pottner@us.af.mil
Archive Date
June 19, 2023