Electrostatic Wafer Bonder/Carrier

Background
The Center for Nanoscale Materials, part of Argonne National Laboratory, is seeking to procure an electrostatic temporary wafer bonder capable of bonding pieces up to a 200 mm substrate.

This procurement aims to enhance their capabilities in nanoscale materials research and development.

Work Details
The contract requires the delivery of an electrostatic wafer bonder with the following specifications:
- The tool must operate on 110V.
- It should bond/clamp materials including Silicon, Glass, Sapphire, diamond, and SiC.
- All wafer carriers must be coated with a Yttrium protective coating for harsh etch environments.
- The tool must maintain its hold while placed on various equipment such as photoresist spinners (max speed of 5000rpm for 30 seconds), NMP (5 minutes), PVD sputter chambers (held upside down), vacuum chambers, and etchers for up to 4 hours or longer.

The bid should include:
- 2 each of the following carriers:
- 100mm carrier for pieces
- 150mm carrier for pieces and smaller wafers
- 200mm carrier for pieces and smaller wafers
- 150mm annulus for a 100mm cutout of a <100> wafer.

Acceptance/Quality Assurance criteria include:
- Demonstration of clamping and release under the following conditions:
- Air: Time of 4 hours
- Vacuum: Time of 4 hours (minimum of 10 mtorr)
- Sample requirements include various sizes and types of silicon and glass pieces bonded to specified carriers.

Place of Performance
The products will be delivered to Argonne National Laboratory located at BLDG. 201 OCF, 9700 S. Cass Ave., Lemont, IL.